129 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3050 series sp3050 lightning surge protection - sp3050 series description applications the sp3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each i/o pin against esd and high surge events. this robust device can safely absorb surge current per iec61000-4-5 (t p =8/20s) without performance degradation and a minimum 20kv esd per iec61000-4-2. their very low loading capacitance also makes them ideal for protecting high speed signal pins. features t & 4 %
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20kv contact, 30kv air t & ' 5
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" (5/50ns) t - j h i u o j o h
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10a (8/20s) t - p x d b q b d j u b o d f p g q ' (typ) per i/o t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m 4 0 5 q b d l b h j o h t - $ % 1 % 1 5 7 t t . p o j u p s t t / p u f c p p l t t & u i f s o f u t ' j s f x j s f t 4 f u 5 p q # p y f t t ' m b u 1 b o f m % j t q m b z t t 1 p s u b c m f . f e j d b m pinout i/o 1 gnd i/o 2 i/o 4 v cc i/o 3 functional block diagram 1 2 3 6 5 4 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application examples v bus v bus v bus v bus d + d + d - d - gnd gnd c t r t r t r t r t c t c t c t usb port usb port usb controller v bus sp30 5 0-04htg usb dual port protection vcc 10/100/1000 ethernet phy tx + tx - rx + rx - vcc gnd tx + tx - rx + rx - unused unused unused rj4 5 unused to twisted-pair network 7 5 7 5 7 5 7 5 10/100/1000 ethernet protection sp30 5 0-0 4 htg 1 2 3 6 5 4 sp3050 series 6v 10a rail clamp array
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 130 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3050 series lightning surge protection - sp3050 series caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. 1 non-repetitive pulse per wavef orm on page 3 absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 1 10 a p pk peak pulse power (t p =8/20s) 150 w t op operating temperature -40 to 85 c t stor storage temperature -50 to 150 c thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units reverse standoff voltage v rwm i r 1a 6.0 v reverse voltage drop v r i r = 1ma 8.0 v reverse leakage current i leak v r =5v 0.1 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, i/o to gnd 2 8.8 10.0 v i pp =5a, t p =8/20s, i/o to gnd 2 11.5 13.0 v i pp =8a, t p =8/20s, i/o to gnd 2 13.2 15.0 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 0.7 esd withstand voltage 1 v esd iec61000-4-2 (contact) 20 kv iec61000-4-2 (air) 30 kv diode capacitance 1 c i/o-gnd reverse bias=0v 2.4 3.0 pf reverse bias=1.65v 2.0 pf diode capacitance 1 c i/o-i/o reverse bias=0v 1.2 pf notes: 1 parameter is guaranteed by design and/or device characterization. 2 repetitive pulse per wavef orm on page 3. clamping voltage vs. i pp 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 1 2 3 4 5 6 7 8 9 10 peak pulse current-i pp (a) clamp voltage (v c ) product characteristics lead plating matte tin lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-223 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13.
131 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3050 series sp3050 lightning surge protection - sp3050 series pulse waveform capacitance vs. reverse bias 0.0 0. 5 1.0 1. 5 2.0 2. 5 3.0 0.0 0. 5 1.0 1. 5 2.0 2. 5 3.0 3. 5 4.0 4. 5 5 .0 dc bias (v) capacitance (pf) v cc =float v cc = 5 v v cc =3.3v 0% 10% 20% 30% 40% 5 0% 60% 70% 80% 90% 100% 110% 0.0 5 .0 10.0 1 5 .0 20.0 2 5 .0 30.0 time (s) percent of i pp time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p reheat ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters ordering information part number package marking min. order qty. SP3050-04HTG sot23-6 l*4 3000 part numbering system part marking system sp 30 5 0 04 h t g series number of channels package h: sot23-6 t= tape & reel g= green C silicon protection array (spa tm ) family of tvs diode arrays l*4 l * 4 product series l = sp30 5 0 number of channels assembly site (varies) l = sp30 5 0 (varies)
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 132 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp3050 series lightning surge protection - sp3050 series embossed carrier tape & reel speci?cation sot23-6 8mm tape and reel general information 1. 3000 pieces per reel. 2. order in multiples of full reels only. 3. meets eia-481 revision "a" specifications. 2.0mm 4.0mm c l 1. 7 5 mm 1. 5 mm dia. hole 8mm 4.0mm 8.4mm 180mm 14.4mm 13mm 60mm access hole user direction of feed pin 1 sot-23 (8mm pocket pitch) package dimensions sot23-6 package sot23-6 pins 6 jedec mo-203 issue a millimeters inches notes min max min max a 0.900 1.450 0.035 0.057 - a1 0.000 0.150 0.000 0.006 - a2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - c 0.080 0.220 0.0031 0.009 - d 2.800 3.000 0.11 0.118 3 e 2.600 3.000 0.102 0.118 - e1 1.500 1.750 0.06 0.069 3 e 0.95 ref 0.0374 ref - e1 1.9 ref 0.0748 ref - l 0.100 0.600 0.004 0.023 4,5 n 666 a 0o 10o 0o 10o - m 2.590 0.102 - o 0.690 .027 typ - p 0.990 .039 typ - r 0.950 0.038 - p r m recommended solder pad layout notes: 1. dimensioning and tolerances per ansi 14.5m-1982. 2. package conforms to eiaj sc-74 (1992). 3. dimensions d and e1 are exclusive of mold ?ash, protrusions, or gate burrs. 4. footlenth l measured at reference to seating plane. 5. l is the length of ?at foot surface for soldering to substrate. 6. n is the number of terminal positions. 7. controling dimension: millimeter. converted inch dimensions are not necessarily exact.
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